SDF SPED MASTER

This new generation flagship solution can increase your production speed to 95-110 m/min in semi-rotary mode and up to 150 m/min in full rotary mode. Its modular and platform-based design allows for economical production in small runs. It also supports automatic distortion calculation, remote internet diagnostics, an interchangeable platform between the flexographic station and die-cutting station, two workflow directions (left to right, right to left), and one platform that fits bandwidths of 370/430/530 mm.

Technical Specifications
ModelSDF 370SDF 430SDF 530Maximum web width380 mm440 mm540 mm
Max unwind diameter800 mm800 mm800 mm
Max rewind diameter600 mm600 mm600 mm
Max die-cut width370 mm430 mm520 mm
Max mechanical speed (full rotary)150 m/min150 m/min150 m/min
Max mechanical speed (semi-rotary)95-110 m/min95-110 m/min95-110 m/min
Semi-rotary repeat length30%-80% of magnetic cylinder perimeter
Die-cut registration tolerance±0.15 mm±0.15 mm±0.15 mm
Air supply8 bar8 bar8 bar
Rated voltage3PH+N+PE3PH+N+PE3PH+N+PE
Machine weight3 tons3.5 tons4 tons
Operating Units

Standard features:

Full rotary flexographic unit for printing, spot varnish, super varnish, cold foil, and lamination.
Full rotary/semi-rotary die-cutting unit with matrix removal, cutting, and double rewind. Suitable for magnetic or solid cylinder.

Features and Advantages

Servo-driven, fully automatic flexographic unit for flexo printing, cold foil, lamination, varnish, and super varnish.
UV/LED dryer with cooling roller to maintain stable tension and constant temperature at all speeds.
Servo-driven die-cutting unit with automatic registration system, switchable between full rotary and semi-rotary modes. Ideal for short to medium runs, especially for digitally printed labels.
Hot air dryer (IR) optional for water-based priming, coating, and lamination.

Applications
Complete digital finishing for electronics, cosmetics, packaging, pharmaceuticals, toys, logistics, apparel, security, and more.

Substrates
Standard material thickness: 35–280 μm for film, paper, adhesive material, and light cardboard. Other special materials require testing.